WORKPIECE POLISHING HEAD

PROBLEM TO BE SOLVED: To provide a workpiece polishing head capable of precisely polishing a workpiece by enabling a carrier to be followed favorably in accordance with the surface condition of a polishing pad.SOLUTION: A workpiece polishing head comprises: a head body 12; a carrier 14 coupled with...

Full description

Saved in:
Bibliographic Details
Main Authors SHIBUYA KAZUTAKA, FUSE TAKAYUKI, TSUKADA MASAYUKI
Format Patent
LanguageEnglish
Japanese
Published 19.07.2018
Subjects
BASIC ELECTRIC ELEMENTS
DRESSING OR CONDITIONING OF ABRADING SURFACES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
SEMICONDUCTOR DEVICES
TRANSPORTING
Online AccessGet full text

Cover

More Information
Summary:PROBLEM TO BE SOLVED: To provide a workpiece polishing head capable of precisely polishing a workpiece by enabling a carrier to be followed favorably in accordance with the surface condition of a polishing pad.SOLUTION: A workpiece polishing head comprises: a head body 12; a carrier 14 coupled with the head body 12 via a flexible diaphragm 16 to hold a workpiece on the bottom face side; a pressure chamber 18, provided by being surrounded with the bottom face of the head body 12, the diaphragm 16, and the top face of the carrier 14; a liquid supply part 47 that supplies a fluid to the pressure chamber 18; an outer cylindrical body 41 anchored on the rotation axis of the head body 12; a direct-acting guide 40 having a spline shaft 42 arranged by keeping a height width movable in the outer cylindrical body 41, and rotation on the axis restricted with respect to the outer cylindrical body 41 to transmit the torque of the head body 12 via the outer cylindrical body 41; and a rotation transmitting plate 45 arranged between the lower end part of the spline shaft 42 and the top face of the carrier 14 to support the carrier 14 to be tiltable, and to transmit the torque of the spline shaft 42 to the carrier 14.SELECTED DRAWING: Figure 1 【課題】キャリアを研磨パッドの表面状態に応じて良好に追従可能で、ワークを精度よく研磨できるワーク研磨ヘッドを提供する。【解決手段】ヘッド本体１２と、ヘッド本体１２にフレキシブルなダイアフラム１６を介して連結され、下面側にワークを保持するキャリア１４と、ヘッド本体１２下面、ダイアフラム１６およびキャリア１４上面で囲まれて設けられた圧力室１８と、圧力室１８に流体を供給する流体供給部４７と、ヘッド本体１２の回転軸線上に固定された外側筒体４１、および外側筒体４１内に高さ幅可動自在、かつ外側筒体４１に対して軸線を中心とする回転を規制されて配設されて、ヘッド本体１２の回転力が前記外側筒体４１を介して伝達されるスプライン軸４２を有する直動ガイド４０と、スプライン軸４２の下端部とキャリア１４上面との間に配設され、キャリア１４を傾動自在に支持すると共に、スプライン軸４２の回転力をキャリア１４に伝達する回転伝達板４５とを具備する。【選択図】図１
Bibliography:Application Number: JP20170001879