WAFER POLISHING SYSTEM

• Main Authors: BAEK SEUNG WON, LEE JAE PYO
• Format: Patent
• Language: English; Japanese
• Published: 12.07.2018
• Subjects: BASIC ELECTRIC ELEMENTS; DRESSING OR CONDITIONING OF ABRADING SURFACES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; SEMICONDUCTOR DEVICES; TRANSPORTING

PROBLEM TO BE SOLVED: To provide a wafer polishing system capable of effectively removing polishing particles adhered to a pipe.SOLUTION: A wafer polishing system includes: a slurry tank 300 which is connected to a slurry distribution section 200 which is mounted in an upper section of a polishing section 100 so as to distribute wafer polishing slurry flowed into the polishing section and stores the slurry; a slurry pump 400 which is connected to the polishing section and the slurry tank so as to transfer the slurry from the slurry tank to the polishing section; a first circulation line 510 which has one side connected to the slurry tank; a second circulation line 520 which has one side connected to the other side of the first circulation line and the other side connected to the slurry distribution section; and a cleaning fluid supply section 600 which is connected to the second circulation line so as to supply cleaning fluid flowing in the second circulation line.SELECTED DRAWING: Figure 1 【課題】配管に固着した研磨用粒子を効果的に除去することができるウエハー研磨システムを提供する。【解決手段】ウエハー研磨システムは、研磨部１００の上部に装着され、前記研磨部に流入するウエハー研磨用スラリー（ｓｌｕｒｒｙ）を分配するスラリー分配部２００に連結され、スラリーを貯蔵するスラリータンク３００、前記研磨部及び前記スラリータンクに連結され、前記スラリータンクから前記研磨部にスラリーを移送するスラリーポンプ４００、一側が前記スラリータンクに連結される第１循環ライン５１０、一側が前記第１循環ラインの他側に連結され、他側は前記スラリー分配部に連結される第２循環ライン５２０、及び前記第２循環ラインに連結され、前記第２循環ラインを流動する洗浄液を供給する洗浄液供給部６００を含む。【選択図】図１