BUMP ELECTRODE ARRAY FOR MICRO ASSEMBLER
PROBLEM TO BE SOLVED: To provide a bump electrode array for micro assembler having no possibility of hindering movement of movable particles on the surface of the electrode array.SOLUTION: Squeeze film impedance is reduced by allowing a thicker assembly fluid film to flow under movable particles in...
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Main Authors | , , |
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Format | Patent |
Language | English Japanese |
Published |
05.07.2018
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Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To provide a bump electrode array for micro assembler having no possibility of hindering movement of movable particles on the surface of the electrode array.SOLUTION: Squeeze film impedance is reduced by allowing a thicker assembly fluid film to flow under movable particles in a region between a curved surface and the movable particles. A method 400 of manufacturing a bump electrode array 420 includes to provide a board 210 for the electrode array. The method further includes to arrange multiple non-planar structures 310 including electrodes on the board of the electrode array, and to arrange a dielectric layer 410 on the multiple non-planar structures having a prescribed radius of curvature.SELECTED DRAWING: Figure 4
【課題】可動粒子が電極アレイの表面上を移動するのを妨げる可能性がないマイクロアセンブラのためのバンプ電極アレイを提供する。【解決手段】曲面と可動粒子との間の領域において可動粒子の下でより厚いアセンブリ流体膜が流れるのを可能にすることにより、スクイーズフィルムインピーダンスを低減する。バンプ電極アレイ420を製造する方法400は、電極アレイのための基板210を提供することを含む。また、電極アレイの基板の上に電極を含む複数の非平面構造310を配置することと、規定の曲率半径を有する複数の非平面構造の上に誘電体層410を配置することを含む。【選択図】図4 |
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Bibliography: | Application Number: JP20170235728 |