COMPOSITE MEMBER

• Main Authors: KONNO TAKAHIRO, SAWAGUCHI JUICHI, SAKAGUCHI KAORI, HAYASAKA TSUTOMU
• Format: Patent
• Language: English; Japanese
• Published: 28.06.2018
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide, with the use of a soft thermal conductive insulation member, a composite member which is suitable for a power semiconductor device and has excellent durability against thermal fatigue.SOLUTION: A composite member comprises: a heat-radiating base substrate; a thermal conductive insulation adhesive member; and a member capable of generating heat. The thermal conductive insulation adhesive member is provided on one surface of the heat-radiating base substrate, while the member capable of generating heat is provided on a surface, of the thermal conductive insulation adhesive member, which is opposite to the heat-radiating base substrate. At temperatures ranging from -40°C to lower than 25°C, the elasticity modulus of the thermal conductive member is 10 GPa or lower, and at temperatures ranging from 25°C to 200°C, the elasticity modulus of the thermal conductive member is 1 GPa or lower.SELECTED DRAWING: Figure 1 【課題】 本発明は、柔軟な熱伝導性絶縁部材の利用により、パワー半導体装置に好適な、熱疲労に対する耐久性に優れる複合部材を提供することを目的とする。【解決手段】 放熱ベース基板と、熱伝導性絶縁接着部材と、熱を発生し得る部材とを有する複合部材であって、前記熱伝導性絶縁接着部材は、前記放熱ベース基板の一方の面に設けられており、前記熱伝導性絶縁接着部材の放熱ベース基板とは反対側に前記の熱を発生し得る部材が設けられており、−４０℃以上２５℃未満の範囲における前記熱伝導性部材の弾性率が１０ＧＰａ以下、かつ、２５℃以上２００℃以下の範囲における前記熱伝導性部材の弾性率が１ＧＰａ以下であることを特徴とする、複合部材。【選択図】 図１