POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD OF CURED PATTERN, CURED PRODUCT, INTERLAYER INSULATING FILM, COVER COAT LAYER, SURFACE PROTECTION FILM, AND ELECTRONIC COMPONENT

PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition which has excellent chemical resistance and mechanical characteristics.SOLUTION: The positive photosensitive resin composition contains (a) a polybenzoxazole precursor including the specified formula (1), (b) two or more cr...

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Main Authors YOTSUYANAGI HIROKO, MIZUNO KOHEI, NAKAMURA TADAMITSU, KAWAMORI TAKASHI, YOSHIZAWA ATSUTARO
Format Patent
LanguageEnglish
Japanese
Published 21.06.2018
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
CINEMATOGRAPHY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
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Abstract PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition which has excellent chemical resistance and mechanical characteristics.SOLUTION: The positive photosensitive resin composition contains (a) a polybenzoxazole precursor including the specified formula (1), (b) two or more crosslinking agents including the specified formula (2), (c) a photosensitizer, and (d) a solvent.SELECTED DRAWING: None 【課題】優れた耐薬品性、機械特性を有するポジ型感光性樹脂組成物を提供する。【解決手段】（ａ）下記式（１）を含むポリベンゾオキサゾール前駆体と、（ｂ）下記式（２）を含む２種類以上の架橋剤、（ｃ）感光剤、（ｄ）溶剤とを含有するポジ型感光性樹脂組成物。【選択図】なし
AbstractList PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition which has excellent chemical resistance and mechanical characteristics.SOLUTION: The positive photosensitive resin composition contains (a) a polybenzoxazole precursor including the specified formula (1), (b) two or more crosslinking agents including the specified formula (2), (c) a photosensitizer, and (d) a solvent.SELECTED DRAWING: None 【課題】優れた耐薬品性、機械特性を有するポジ型感光性樹脂組成物を提供する。【解決手段】（ａ）下記式（１）を含むポリベンゾオキサゾール前駆体と、（ｂ）下記式（２）を含む２種類以上の架橋剤、（ｃ）感光剤、（ｄ）溶剤とを含有するポジ型感光性樹脂組成物。【選択図】なし
Author NAKAMURA TADAMITSU
YOTSUYANAGI HIROKO
KAWAMORI TAKASHI
YOSHIZAWA ATSUTARO
MIZUNO KOHEI
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– fullname: NAKAMURA TADAMITSU
– fullname: KAWAMORI TAKASHI
– fullname: YOSHIZAWA ATSUTARO
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Chemistry
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Physics
DocumentTitleAlternate ポジ型感光性樹脂組成物、硬化パターンの製造方法、硬化物、層間絶縁膜、カバーコート層、表面保護膜及び電子部品
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Snippet PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition which has excellent chemical resistance and mechanical characteristics.SOLUTION:...
SourceID epo
SourceType Open Access Repository
SubjectTerms APPARATUS SPECIALLY ADAPTED THEREFOR
CINEMATOGRAPHY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
Title POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD OF CURED PATTERN, CURED PRODUCT, INTERLAYER INSULATING FILM, COVER COAT LAYER, SURFACE PROTECTION FILM, AND ELECTRONIC COMPONENT
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