POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD OF CURED PATTERN, CURED PRODUCT, INTERLAYER INSULATING FILM, COVER COAT LAYER, SURFACE PROTECTION FILM, AND ELECTRONIC COMPONENT

PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition which has excellent chemical resistance and mechanical characteristics.SOLUTION: The positive photosensitive resin composition contains (a) a polybenzoxazole precursor including the specified formula (1), (b) two or more cr...

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Bibliographic Details
Main Authors YOTSUYANAGI HIROKO, MIZUNO KOHEI, NAKAMURA TADAMITSU, KAWAMORI TAKASHI, YOSHIZAWA ATSUTARO
Format Patent
LanguageEnglish
Japanese
Published 21.06.2018
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
CINEMATOGRAPHY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
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Summary:PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition which has excellent chemical resistance and mechanical characteristics.SOLUTION: The positive photosensitive resin composition contains (a) a polybenzoxazole precursor including the specified formula (1), (b) two or more crosslinking agents including the specified formula (2), (c) a photosensitizer, and (d) a solvent.SELECTED DRAWING: None 【課題】優れた耐薬品性、機械特性を有するポジ型感光性樹脂組成物を提供する。【解決手段】（ａ）下記式（１）を含むポリベンゾオキサゾール前駆体と、（ｂ）下記式（２）を含む２種類以上の架橋剤、（ｃ）感光剤、（ｄ）溶剤とを含有するポジ型感光性樹脂組成物。【選択図】なし
Bibliography:Application Number: JP20160242678