COMPOSITION FOR FLEXIBLE CIRCUIT BOARD AND CURED PRODUCT THEREOF

• Main Authors: YUN GEUM HEE, SHIM JI HYE, LEE HWA YOUNG, YOO SEONG HYUN, CHONG SEOL AH
• Format: Patent
• Language: English; Japanese
• Published: 14.06.2018
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

PROBLEM TO BE SOLVED: To provide a composition for a flexible circuit board and a cured product thereof.SOLUTION: A composition according to the present invention has excellent flexibility, mechanical properties, and adhesive force, can be cured at low temperature, can be substituted for expensive polyimide, and does not need to form a separate adhesive layer, and can provide economically and efficiently a flexible circuit board reduced in size and weight.SELECTED DRAWING: Figure 2 【課題】 本発明は、フレキシブル回路基板用組成物及びその硬化物を提供する。【解決手段】 本発明に係る組成物は、優れた屈曲性、機械的特性及び接着力を有し、低温硬化が可能であって、高価のポリイミドに代替可能であり、別途の接着層を形成する必要がない、軽薄短小化されたフレキシブル回路基板を経済的でかつ効率的に提供することができる。【選択図】図２