BONDING CAPILLARY

• Main Authors: ISHIZUKA YUJI, SHIMOHARA YUICHI, ONISHI JUMPEI, NAKAMURA ASUKA
• Format: Patent
• Language: English; Japanese
• Published: 14.06.2018
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a bonding capillary capable of generating high bonding strength.SOLUTION: A bonding capillary comprises: a first body section which is extended in an axial direction; a second body section which is installed at a tip side of the first body section with a cross-section area thereof gradually reduced toward a tip; a bottle neck section which is installed at the tip side of the second body section; and an insertion hole which is extended in the axial direction and allows a wire to be inserted therein in a manner that penetrates the first body section, the second body section and the bottle neck section. The bottle neck section has a first portion and a second portion which is installed at the tip side of the first portion. The second portion has a pressing face to press the wire, at the tip thereof. The first portion is inwardly concaved from a tangent line of the second body section. The maximum cross-section area of the second portion is larger than the minimum cross-section area of the first portion.SELECTED DRAWING: Figure 2 【課題】高い接合強度を得ることができるボンディングキャピラリを提供する。【解決手段】軸方向に延びる第１本体部と、前記第１本体部の先端側に設けられ、先端に向かって断面積が小さくなる第２本体部と、前記第２本体部の先端側に設けられたボトルネック部と、前記軸方向に延び、前記第１本体部、前記第２本体部、及び前記ボトルネック部を貫通してワイヤの挿通を可能とする挿通孔と、を備え、前記ボトルネック部は、第１部分と、前記第１部分の先端側に設けられた第２部分と、を有し、前記第２部分は、前記ワイヤを押圧する押圧面を先端に有し、前記第１部分は、前記第２本体部の接線よりも内側に凹み、前記第２部分の最大の断面積は、前記第１部分の最小の断面積よりも大きいことを特徴とするボンディングキャピラリが提供される。【選択図】図２