CIRCUIT DEVICE

• Main Author: KITA YUKINORI
• Format: Patent
• Language: English; Japanese
• Published: 14.06.2018
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

PROBLEM TO BE SOLVED: To provide a circuit device capable of simplifying a manufacturing process while ensuring insulation between a circuit structure and a heat radiating member and reducing the manufacturing cost.SOLUTION: A circuit device 10 includes a circuit component 11, a heat sink 30 that is disposed so as to overlap with the circuit component 11 and dissipates heat from the circuit component 11, an insulating second adhesive sheet 40 that is interposed between the circuit component 11 and the heat sink 30 and that adheres the circuit component 11 and the heat sink 30. In such a configuration, by using the second adhesive sheet 40 that can easily control the thickness as compared with a liquid adhesive, the insulation property between the circuit component 11 and the heat sink 30 can be easily and reliably ensured. In addition, compared with a configuration in which an adhesive is applied twice, the manufacturing process can be simplified and the manufacturing cost can be reduced.SELECTED DRAWING: Figure 1 【課題】回路構成体と放熱部材との間の絶縁性を確保しつつ製造工程を簡略化し、製造コストを低減できる回路装置を提供する。【解決手段】回路装置１０は、回路構成体１１と、回路構成体１１に重ねて配置され、回路構成体１１からの熱を放熱するヒートシンク３０と、回路構成体１１とヒートシンク３０との間に介在して回路構成体１１とヒートシンク３０とを接着する絶縁性の第２接着シート４０とを備える。このような構成によれば、液状の接着剤と比較して厚さの管理が容易な第２接着シート４０を用いることにより、回路構成体１１とヒートシンク３０との絶縁性を容易かつ確実に確保できる。また、接着剤を二度塗りする構成と比較して、製造工程を簡素化し、製造コストを低減することができる。【選択図】図１