METHOD FOR FORMING FILM ON SUBSTRATE, AND FILM DEPOSITION SYSTEM

• Main Authors: TAKEI JUNICHI, SUZUKI NAOYUKI, MIYASHITA TETSUYA
• Format: Patent
• Language: English; Japanese
• Published: 14.06.2018
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SEMICONDUCTOR DEVICES; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

PROBLEM TO BE SOLVED: To provide a film deposition system needing no separate mechanism for moving a substrate linearly in a treatment chamber of the film deposition system.SOLUTION: A film deposition system comprises a film deposition apparatus and a transportation module. The film deposition apparatus includes a chamber body for providing a treatment chamber, and a holder for holding a target disposed in the treatment chamber. The transportation module includes another chamber body for providing a transfer chamber capable of being connected to the treatment chamber, and a transportation device for transporting a substrate. A method comprises: a step ST1 of transporting the substrate by the transportation device from the transfer chamber to the treatment chamber; and a step ST3, at which the transportation device supports the substrate in the processing chamber, and at which the particles are discharged from a target so as to form a film on the substrate while the substrate is being linearly moved.SELECTED DRAWING: Figure 1 【課題】成膜装置の処理チャンバ内において基板を直線的に移動させるための別途の機構を不要とする成膜システムの提供。【解決手段】成膜システムは、成膜装置及び搬送モジュールを備える。成膜装置は、処理チャンバを提供するチャンバ本体と、処理チャンバ内に設けられたターゲットを保持するホルダと、を有する。搬送モジュールは、処理チャンバに接続可能な搬送チャンバを提供する別のチャンバ本体と、基板を搬送するための搬送装置と、を有する。方法は、搬送装置によって搬送チャンバから処理チャンバに基板を搬送する工程ＳＴ１と、搬送装置が処理チャンバ内において基板を支持し、且つ、基板を直線的に移動させている状態で、基板上に膜を形成するためにターゲットから粒子を放出させる工程ＳＴ３と、を含む成膜システム。【選択図】図１