VACUUM PROCESSING APPARATUS AND PARTICLE MEASUREMENT METHOD

• Main Author: NAGAIKE HIROSHI
• Format: Patent
• Language: English; Japanese
• Published: 07.06.2018
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To measure ultrafine particles under the condition that the pressure inside a chamber is less than 1 Torr.SOLUTION: A vacuum processing apparatus includes; a chamber for performing predetermined processing; a first exhaust unit which is connected to an exhaust port of the chamber to exhaust air inside the chamber; piping connected to the chamber in the vicinity of the exhaust port; a particle monitoring unit which is connected to the piping to measure particles passing through inside the piping; a second exhaust unit which is connected to the particle monitoring unit via the piping to exhaust air inside the piping; and a control unit for controlling air exhaustion inside the chamber and the piping by the first and second exhaust units, and controlling particle measurement by the particle monitoring unit.SELECTED DRAWING: Figure 5 【課題】チャンバの圧力が１Ｔｏｒｒ未満の条件において微小パーティクルの計測を行うことを目的とする。【解決手段】所定の処理を行うチャンバと、前記チャンバの排気口に接続され、前記チャンバの内部を排気する第１の排気装置と、前記排気口の近傍にて前記チャンバに接続される配管と、前記配管に接続され、前記配管の内部を通るパーティクルを計測するパーティクルモニタ装置と、前記配管を介して前記パーティクルモニタ装置に接続され、前記配管の内部を排気する第２の排気装置と、前記第１の排気装置及び前記第２の排気装置による前記チャンバの内部及び前記配管の内部の排気を制御し、前記パーティクルモニタ装置によるパーティクルの計測を制御する制御部と、を有する、真空処理装置が提供される。【選択図】図５