WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

• Main Authors: FURUTA TORU, IMABAYASHI KENJI
• Format: Patent
• Language: English; Japanese
• Published: 31.05.2018
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

PROBLEM TO BE SOLVED: To provide a wiring board by which the variation in the circuit width of a wiring pattern in a thickness direction can be reduced as compared to that in the past; and a method for manufacturing the wiring board.SOLUTION: A method for manufacturing a wiring board 10 according to the present invention comprises the steps of: preparing a metal layer 54 laminated on a support plate 50; performing a preceding stage of etching which includes the steps of partially covering an F-face 54F of the metal layer 54 with a first etching resist layer 55 having a first pattern 55A, and removing the metal layer 54 to a position halfway across its thickness in a thickness direction; and performing a later stage of etching which includes the steps of laminating an insulator layer 15 on the metal layer 54 from the side of the F-face 54F thereof, removing the support substrate 50, partially covering an S-face 54S of the metal layer 54, which is a face on the side where the support plate 50 is removed, with a second etching resist 56 having a first pattern 56A, and removing wholly the metal layer from the S-face 54S in the thickness direction, whereby a wiring pattern 21 is thus formed from the metal layer 54.SELECTED DRAWING: Figure 1 【課題】配線パターンの厚さ方向における電路幅の大小差を従来より抑えることが可能な配線板及びその製造方法を提供する。【解決手段】本発明の配線基板１０の製造方法は、支持板５０上に積層されている金属層５４を用意することと、金属層５４のＦ面５４Ｆを、第１パターン５５Ａを有する第１エッチングレジスト層５５で部分的に覆い、金属層５４の厚さ方向の途中位置までを除去する前段エッチング処理と、金属層５４のＦ面５４Ｆ側から絶縁層１５を積層することと、支持基板５０を除去し、金属層５４のうち支持板５０を除去した側の面であるＳ面５４Ｓを、第１パターン５６Ａを有する第２エッチングレジスト５６で部分的に覆いＳ面５４Ｓから厚さ方向に亘って除去する後段エッチングを行い、金属層５４から配線パターン２１を形成する。【選択図】図１