MANUFACTURING METHOD OF SUBSTRATE TERMINAL BOARD FOR FITTING SEMICONDUCTOR ELEMENT

PROBLEM TO BE SOLVED: To obtain a substrate terminal plate in which heat release is good with a simple structure, by reducing the number of components while ensuring heat dissipation by using a conductor plate, constituting the substrate terminal plate, itself.SOLUTION: Radiation fins 14 and heat si...

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Bibliographic Details
Main Authors YUASA MAMORU, WAKABAYASHI SHOJIRO, NAKAGAWA MASAYA, WATANABE TOSHIFUMI
Format Patent
LanguageEnglish
Japanese
Published 24.05.2018
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Summary:PROBLEM TO BE SOLVED: To obtain a substrate terminal plate in which heat release is good with a simple structure, by reducing the number of components while ensuring heat dissipation by using a conductor plate, constituting the substrate terminal plate, itself.SOLUTION: Radiation fins 14 and heat sinks 15 are provided by cutting and raising the radiation fins 14 at multiple positions around the element fitting part of a conductor plate 10 for upper substrate. An upper substrate 3 is formed by coating the conductor plate 10 for upper substrate with a painted film 7, and a lower substrate 2 is formed by coating a conductor plate 6 for lower substrate with the painted film 7. Heat treatment processing for compressing the lower substrate 2 and the upper substrate 3 in a superposed state from above and below and heating them, are performed to the lower substrate 2 and the upper substrate 3 and the painted film 7 is hardened completely, thus bonding the painted films 7 of the lower substrate 2 and upper substrate 3.SELECTED DRAWING: Figure 1 【課題】基板端子板を構成する導体板自体を利用して放熱性を確保しながら部品点数を削減し、簡易な構造でありながらも放熱が良好となる基板端子板を得る。【解決手段】上基板用導体板10での素子取付部の周囲となる複数位置で放熱フィン14の切り起こしを行なって、放熱フィン14と放熱口15とを設けて、この上基板用導体板10を塗装膜7で被覆して上基板3を形成するとともに、下基板用導体板6を塗装膜7で被覆して下基板2を形成し、下基板2と上基板3とを重ね合わせて上下から加圧するとともに加熱する加圧加熱処理を下基板2と上基板3とに施して、塗装膜7を完全硬化させることにより、下基板2の塗装膜7と上基板3の塗装膜7とを接着させる。【選択図】図1
Bibliography:Application Number: JP20160224343