COMPONENT MOUNTING DEVICE

PROBLEM TO BE SOLVED: To provide a component mounting device capable of reducing capacity of a negative pressure generation part for supplying negative pressure for holding components by mounting heads.SOLUTION: A component mounting device 100 includes: a head unit 4 including a plurality of mountin...

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Bibliographic Details
Main Author ONISHI MASASHI
Format Patent
LanguageEnglish
Japanese
Published 17.05.2018
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:PROBLEM TO BE SOLVED: To provide a component mounting device capable of reducing capacity of a negative pressure generation part for supplying negative pressure for holding components by mounting heads.SOLUTION: A component mounting device 100 includes: a head unit 4 including a plurality of mounting heads 42 for mounting components 31 on a substrate P; an ejector 44 which supplies negative pressure for holding the components 31 by the mounting head 42 at the time of operation for at least mounting the components 31 by the mounting heads 42; a Z-axis motor 45 for moving the mounting heads 42 in the up-and-down direction; and magnet parts 48 by which the tip for absorbing the components 31 of the mounting heads 42 is made to generate magnetic force when the mounting head 42 are lifted.SELECTED DRAWING: Figure 6 【課題】実装ヘッドにより部品を保持するための負圧を供給する負圧発生部の容量を小さくすることが可能な部品実装装置を提供する。【解決手段】この部品実装装置１００は、基板Ｐに部品３１を実装する複数の実装ヘッド４２を含むヘッドユニット４と、実装ヘッド４２により部品３１を少なくとも装着する動作の際に実装ヘッド４２により部品３１を保持するための負圧を供給するエジェクタ４４と、実装ヘッド４２を上下方向に移動させるＺ軸モータ４５と、実装ヘッド４２が上昇された場合に、実装ヘッド４２の部品３１を吸着する先端部に磁力を発生させる磁石部４８とを備える。【選択図】図６
Bibliography:Application Number: JP20160220888