RESIN FOR HOT MELT ADHESIVE, RESIN COMPOSITION FOR HOT MELT ADHESIVE COMPRISING THE SAME AND HOT MELT ADHESIVE

• Main Authors: SUDO TAKESHI, UTAZAKI KENICHI
• Format: Patent
• Language: English; Japanese
• Published: 17.05.2018
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; DYES; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; USE OF MATERIALS AS ADHESIVES

PROBLEM TO BE SOLVED: To provide a resin for a hot melt adhesive excellent in melt fluidity, adhesiveness, toughness or the like which is used by using a specific terminal-modified polyamide resin and to provide a resin composition for a hot melt adhesive comprising the same.SOLUTION: There is provided a hot melt adhesive which is a resin for a hot melt adhesive comprising a terminal-modified polyamide resin containing 1 to 20 mass% of a terminal structure represented by the following general formula (I): -X-(R-O)-R(I) (where, m represents a range of 2 to 100; Rrepresents a divalent hydrocarbon group having 2 to 10 carbon atoms; Rrepresents a monovalent hydrocarbon group having 1 to 30 carbon atoms or a hydrogen group; -X- represents -NH-, -N(CH)- or -(C=O)-; and m Rs contained in the general formula (I) may be the same or different.)SELECTED DRAWING: None 【課題】本発明は、特定の末端変性ポリアミド樹脂を用いることにより得られる、溶融流動性、接着性および靭性等に優れたホットメルト接着剤用樹脂、それを含むホットメルト接着剤用樹脂組成物およびホットメルト接着剤を提供する。【解決手段】本発明のホットメルト接着剤は、下記一般式（Ｉ）で表される末端構造を１〜２０質量％含有する末端変性ポリアミド樹脂を含むホットメルト接着剤用樹脂である。−Ｘ−（Ｒ１−Ｏ）ｍ−Ｒ２（Ｉ）（上記の一般式（Ｉ）中、ｍは２〜１００の範囲を表す。Ｒ１は炭素数２〜１０の２価の炭化水素基を、Ｒ２は炭素数１〜３０の１価の炭化水素基または水素基をそれぞれ表す。−Ｘ−は−ＮＨ−、−Ｎ（ＣＨ３）−または−（Ｃ＝Ｏ）−を表す。一般式（Ｉ）中に含まれるｍ個のＲ１は、同じでも異なっていてもよい。）【選択図】 なし