ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

• Main Authors: KURIHARA TOMOYUKI, KAWAUCHI OSAMU, YAMAUCHI MOTOI
• Format: Patent
• Language: English; Japanese
• Published: 10.05.2018
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To ensure low profile.SOLUTION: An electronic component includes a board 10, a device chip 20 where a functional part 22 is provided on the lower surface, a first metal film 26 is provided on the lateral face, the first metal film is not provided on the upper surface, and the device chip is mounted on the upper surface of the board so that the functional part and the upper surface of the board face via a cavity 38, a metal sealing part 30 composed of a brazing material surrounding the device chip, and provided to be bonded to the first metal film and the upper surface of the board thus sealing the cavity, and a second metal film 34 provided on the lateral face and the upper surface of the metal sealing part, and is not provided in at least an area of the upper surface of the device chip overlapping the functional part, in the plan view.SELECTED DRAWING: Figure 1 【課題】低背化すること。【解決手段】基板１０と、下面に機能部２２が設けられ、側面に第１金属膜２６が設けられ、上面に前記第１金属膜が設けられておらず、前記機能部と前記基板の上面とが空隙３８を介し対向するように、前記基板の上面に実装されたデバイスチップ２０と、前記デバイスチップを囲み、前記第１金属膜および前記基板の上面に接合し前記空隙を封止するように設けられたろう材からなる金属封止部３０と、前記金属封止部の側面および上面に設けられ、前記デバイスチップの上面のうち少なくとも平面視において前記機能部と重なる領域に設けられていない第２金属膜３４と、を具備する電子部品。【選択図】図１