RESIN SEALED TYPE SEMICONDUCTOR DEVICE

• Main Authors: KASHIWABARA TOSHIAKI, SHIRAKATA YUJI, MIYAMOTO TERUO, KATO MASAKI, FUJII KENTA, MITSUI TAKAO
• Format: Patent
• Language: English; Japanese
• Published: 10.05.2018
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a resin sealed type semiconductor device capable of blocking an overcurrent with certainty, and that is excellent in smoking and firing resistance.SOLUTION: In a resin sealed type semiconductor device that comprises a power semiconductor element and a power lead connected with a main electrode of the power semiconductor element, the power semiconductor element is molded with a resin, and the power lead is provided protrusively from a mold resin part. The resin sealed type semiconductor device comprises: a fuse part formed on the power lead; a first resin encapsulation part that covers the fuse part; and a second resin encapsulation part that shields the first resin encapsulation part from atmosphere and configures the mold resin part.SELECTED DRAWING: Figure 2 【課題】過電流を確実に遮断するとともに、発煙および発火の耐性に優れた樹脂封止型半導体装置を得る。【解決手段】電力用半導体素子と、電力用半導体素子の主電極に接続されたパワーリードと、を備え、電力用半導体素子を樹脂でモールドするとともに、パワーリードをモールド樹脂部から突設させた樹脂封止型半導体装置であって、パワーリードに形成されたヒューズ部と、ヒューズ部を被覆する第１樹脂封止部と、第１樹脂封止部を大気から遮断するとともに、モールド樹脂部を構成する第２樹脂封止部と、を有するものである。【選択図】図２