HEAT SINK, COOLER INCLUDING HEAT SINK, METHOD OF MANUFACTURING HEAT SINK, AND COOLING METHOD OF COOLING OBJECT

• Main Authors: MURAKAMI MASAAKI, IDE TAKUYA, NUMATA TOMIYUKI
• Format: Patent
• Language: English; Japanese
• Published: 10.05.2018
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a cooler capable of cooling an electronic circuit device with high calorific value, such as a CPU or a chip set, efficiently, and can be constituted lighter and more compact, and to provide a board or a computer including the same.SOLUTION: A heat sink includes a metal heat absorber 2 having an abutment surface 20 abutting on a cooling object 9, and transmitting heat of the cooling object 9, and a metal tabular fin 3 projecting from the side 21 of the heat absorber 2 adjacent to the abutment surface 20. The tabular fin 3 is projected so that the plate surface is parallel with the abutment surface 20, or tilting in a range of a prescribed angle or less, and multiple through holes 31 opening to the plate surface are formed.SELECTED DRAWING: Figure 1 【課題】ＣＰＵやチップセットなどの発熱量の多い電子回路デバイスを効率よく冷却することができ、より軽量かつコンパクトに構成できる冷却装置、これを備える基板やコンピュータを提供せんとする。【解決手段】 冷却対象物９に当接される当接面２０を有し、該当接面２０を通じて冷却対象物９の熱が伝達される金属製の吸熱体２と、該吸熱体２の当接面２０に隣接する周囲の側面２１に突設される金属製の板状フィン３とを備え、板状フィン３が、当接面２０に対して板面が平行又は所定の角度以下の範囲で傾斜した形態に突設され、且つ該板面に開口する複数の貫通孔３１が形成されている。【選択図】図１