MULTILAYER PHOTOSENSITIVE FILM

PROBLEM TO BE SOLVED: To provide a photosensitive film which can prevent offset (offset) at the time of via formation even when containing a large amount of fillers, can form fine vias and fine pitches even in a thin film and can prevent undercut (undercut) at the time of via formation even when con...

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Bibliographic Details
Main Authors YUN GEUM HEE, SHIN SANG EUN, LEE HWA YOUNG, CHONG SEOL AH, KIM SANG AH, OGI SATOSHI
Format Patent
LanguageEnglish
Japanese
Published 10.05.2018
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Summary:PROBLEM TO BE SOLVED: To provide a photosensitive film which can prevent offset (offset) at the time of via formation even when containing a large amount of fillers, can form fine vias and fine pitches even in a thin film and can prevent undercut (undercut) at the time of via formation even when containing a large amount of fillers, and accordingly is strong in warpage and excellent in reliability.SOLUTION: A photosensitive film contains a first layer and a second layer formed on an upper surface of the first layer, where the first layer and the second layer are formed of a photocurable resin composition containing a photoinitiator (PI), a photoabsorber (PA) and an inorganic filler, a content of the photoinitiator of the first layer is 0.2-0.7 pts.wt. based on the whole weight of the photocurable resin composition, a content of the photoinitiator of the second layer is 0.1-0.3 pts.wt. based on the whole weight of the photocurable resin composition, and the content of the photoinitiator of the first layer is larger than the content of the photoinitiator of the second layer.SELECTED DRAWING: Figure 1 【課題】多量のフィラーを含んでも、ビア形成時にオフセット(offset)を防止することができ、薄膜でも微細ビア及び微細ピッチの形成が可能であり、多量のフィラーを含んでもビア形成時にアンダーカット(undercut)を防止することができるので、反りに強く信頼性に優れた感光性フィルムを提供する。【解決手段】第1層と、第1層の上面に形成される第2層とを含み、上記第1層及び第2層は、光開始剤(PI)、光吸収剤(PA)及び無機充填材を含む光硬化性樹脂組成物で形成され、上記第1層の上記光開始剤の含量は、光硬化性樹脂組成物の全体重量を基準にして0.2〜0.7重量部で含まれ、上記第2層の上記光開始剤の含量は、光硬化性樹脂組成物の全体重量を基準にして0.1〜0.3重量部で含まれ、上記第1層の光開始剤の含量が第2層の光開始剤の含量よりも大きいことを特徴とする。【選択図】図1
Bibliography:Application Number: JP20170185657