PHOTOSENSITIVE RESIN COMPOSITION FOR PATTERNING, CURED FILM, LOW REFRACTIVE INDEX FILM, OPTICAL DEVICE, AND METHOD OF FORMING PATTERNED CURED FILM OR LOW REFRACTIVE INDEX FILM

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition for patterning that is easy to form a pattern of good shape, in a desired dimension, without generating residues, in a wide range of amounts of exposure; a cured film and a low refractive index film, formed by curing the photosensit...

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Bibliographic Details
Main Authors TAMURA KOKI, TAKEUCHI HIROAKI
Format Patent
LanguageEnglish
Japanese
Published 10.05.2018
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Summary:PROBLEM TO BE SOLVED: To provide a photosensitive resin composition for patterning that is easy to form a pattern of good shape, in a desired dimension, without generating residues, in a wide range of amounts of exposure; a cured film and a low refractive index film, formed by curing the photosensitive resin composition for patterning; an optical device having the cured film or the low refractive index film; a method for producing a cured film or a low refractive index film using the photosensitive resin composition for patterning.SOLUTION: A photosensitive resin composition for patterning contains a resin (A), a photopolymerizable compound (B), and a polymerization initiator (C). In the photosensitive resin composition, blended is a hindered phenolic compound with a molecular weight of 230-1500 as a polymerization inhibitor (D).SELECTED DRAWING: None 【課題】幅広い露光量において、残渣を生じることなく、形状の良好なパターンを所望の寸法で形成しやすい、パターン形成用感光性樹脂組成物と、当該パターン形成用感光性樹脂組物を硬化させて形成された硬化膜及び低屈折率膜と、当該硬化膜又は当該低屈折率を備える光学デバイスと、前述のパターン形成用感光性樹脂組成物を用いる硬化膜又は低屈折率膜の製造方法とを提供すること。【解決手段】樹脂(A)と、光重合性化合物(B)と、重合開始剤(C)とを含むパターン形成用感光性樹脂組成物に、分子量230〜1500のヒンダードフェノール系化合物を重合禁止剤(D)として配合する。【選択図】なし
Bibliography:Application Number: JP20160213465