LED MODULE

• Main Author: KOBAYAKAWA MASAHIKO
• Format: Patent
• Language: English; Japanese
• Published: 26.04.2018
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide an LED module which is higher in reliability.SOLUTION: An LED module A1 comprises: a substrate 1; an LED chip 3; a metal wiring line 2 having a mounting part 212 on which the LED chip is mounted; a sealing resin 4 covering the LED chip and the metal wiring line; and a coating member 6 covering the metal wiring line with the mounting part exposed. The sealing resin covers the coating member. The metal wiring line has a wire bonding part, and includes a wire 5 connecting between the LED chip and the wire bonding part. The coating member exposes the wire bonding part and covers the metal wiring line. The metal wiring line has a first metal terminal 21 including the mounting part and a second metal terminal 22 including the wire bonding part. The coating member comprises a first coating member 61 partially covering the first metal terminal and a second coating member 62 partially covering the second metal terminal. The substrate has a first edge that the first metal terminal reaches, and a second edge that the second metal terminal reaches. The first coating member is spaced apart from the first edge.SELECTED DRAWING: Figure 2 【課題】より信頼性の高いＬＥＤモジュールを提供する。【解決手段】ＬＥＤモジュールＡ１は、基板１と、ＬＥＤチップ３と、ＬＥＤチップが搭載される搭載部２１２を有する金属配線２と、ＬＥＤチップおよび金属配線を覆う封止樹脂４と、搭載部を露出させ金属配線を覆う被覆部材６を備える。封止樹脂は被覆部材を覆い、金属配線はワイヤボンディング部を有し、ＬＥＤチップとワイヤボンディング部を接続するワイヤ５を備える。被覆部材はワイヤボンディング部を露出させ金属配線を覆い、金属配線は搭載部を含む第１の金属端子２１とワイヤボンディング部を含む第２の金属端子２２とを備え、被覆部材は第１の金属端子の一部を覆う第１の被覆部材６１と第２の金属端子の一部を覆う第２の被覆部材６２とにより構成され、基板は第１の金属端子が到達する第１の端縁と第２の金属端子が到達する第２の端縁とを有し、第１の被覆部材は第１の端縁から離間している。【選択図】図２