WALL FACE CHIPPING DEVICE AND WALL FACE CHIPPING METHOD

• Main Authors: MURATA HIROHIKO, HOTATE NAOHITO, ENDO KAZUHIRO, HIDAKA KOJI, KAMIYA SATOSHI, TAJIMA KAZUFUMI, TAKAI SHINICHIRO, DOI TOSHIMASA
• Format: Patent
• Language: English; Japanese
• Published: 19.04.2018
• Subjects: BUILDING; BUILDING IMPLEMENTS OR OTHER BUILDING AIDS, OR THEIRUSE; CUTTING; CUTTING-OUT; FIXED CONSTRUCTIONS; FORMS; HAND CUTTING TOOLS; HANDLING BUILDING MATERIALS ON THE SITE; PERFORATING; PERFORMING OPERATIONS; PUNCHING; REPAIRING, BREAKING-UP OR OTHER WORK ON EXISTINGBUILDINGS; SCAFFOLDING; SEVERING; SEVERING BY MEANS OTHER THAN CUTTING; SHUTTERING; STAMPING-OUT; TRANSPORTING

PROBLEM TO BE SOLVED: To provide a wall face chipping device and a wall face chipping method which suppresses that a large constant region not yet chipped is produced along one side edge or along an upper edge of a wall face when travelling a chipping device over the whole of the wall face and secures a travelling resistance due to adsorption and so much straight travelling performance as not to be influenced by jetting reactive force of the chipping part.SOLUTION: A wall face chipping device includes: a chipping part 1 capable of cutting a surface of an object wall W according to a chipping movement of a plurality of swivel units 11; an adsorption part 2 which is adsorbed onto an object wall face FW with such an adsorption force that the own device does not fall; and a travelling device 3 which travels on the object wall face FW while being adsorbed on the wall face. A gravity center G1 of the wall face chipping device 100 is set on the travelling width direction inner side than a width W1 of a chipping range S1 of the chipping part 1, at the same time, all travelling wheels 31 are arranged in a plane on the travelling width direction inner side than the width W1 of the chipping range S1 of the chipping part 1 and all adsorption ranges A2 according to the adsorption part 2 are arranged in a plane so as to enter to the travelling width direction inner side than the width W1 of the chipping range S1 of the chipping part 1.SELECTED DRAWING: Figure 2 【課題】壁面全体にハツリ装置を走行させた場合、壁面の片側辺沿いや上辺沿いに大きな一定のハツリ残し領域が生じることを抑制し、また、吸着による走行抵抗やハツリ部の噴射反力によって影響されないだけの直進走行性を確保する。【解決手段】複数のスイベルユニット１１のハツリ動作によって対象壁Ｗの表面を切削可能なハツリ部１と、自装置が落下しない吸着力で対象壁面ＦＷに吸着する吸着部２と、壁面に吸着させたまま対象壁面ＦＷ上で走行させる走行装置３とからなる。ハツリ部１のハツリ範囲Ｓ１の幅Ｗ１よりも走行幅方向内側に、前記壁面ハツリ装置１００の重心位置Ｇ１が設定されると共に、ハツリ部１のハツリ範囲Ｓ１の幅Ｗ１よりも走行幅方向内側に、すべての走行輪３１が平面配置されてなり、かつ、ハツリ部１のハツリ範囲Ｓ１の幅Ｗ１よりも走行幅方向内側に、吸着部２によるすべての吸着範囲Ａ２が入るように平面配置される。【選択図】図２