APPARATUS FOR PROCESSING RESIN FILM

• Main Authors: SUDO FUMIHIKO, MIZOZOE TAKAAKI, EZAKI MAKOTO
• Format: Patent
• Language: English; Japanese
• Published: 19.04.2018
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; CHEMISTRY; CLADDING OR PLATING BY SOLDERING OR WELDING; COMPOSITIONS BASED THEREON; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; GENERAL PROCESSES OF COMPOUNDING; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; SOLDERING OR UNSOLDERING; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; WELDING; WORKING BY LASER BEAM; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; WORKING-UP

PROBLEM TO BE SOLVED: To provide an apparatus for processing a resin film, which can stably form pores in the resin film.SOLUTION: An apparatus 1 for processing a resin film 20 comprises: conveying means 2 for conveying the resin film; pore forming means 3 for forming a pore 201 in the resin film 20; a Charge Coupled Device (CCD) 14 serving as detection means for detecting a size of the pore 201 after formation of the pore 201; and control means. The conveying means 2 includes a wrap angle adjusting mechanism for adjusting a wrap angle of the resin film 20 relative to a roller 21 with grooves. The control means includes: an input unit for inputting a size of the pore 201 as a target value; an arithmetic unit for changing a magnitude of the wrap angle, and changing an irradiation condition on the basis of the target value inputted into the input unit; and an output unit for outputting the irradiation condition changed at the arithmetic unit, to the pore forming means 3, and outputting the wrap angle changed at the arithmetic unit, to the wrap angle adjusting mechanism. The arithmetic unit changes the irradiation condition and the wrap angle according to the detection result of the CCD 14 (detection means).SELECTED DRAWING: Figure 14 【課題】樹脂フィルムに孔を安定して形成することができる樹脂フィルム加工装置を提供すること。【解決手段】樹脂フィルム加工装置１は、樹脂フィルム２０を搬送する搬送手段２と、樹脂フィルム２０に孔２０１を形成する孔形成手段３と、孔２０１の形成後に孔２０１の大きさを検出する検出手段としてのＣＣＤ１４と、制御手段とを備える。搬送手段２は、溝付きローラ２１に対する樹脂フィルム２０の抱き角を調整する抱き角調整機構を有する。制御手段は、目標値としての孔２０１の大きさを入力する入力部と、抱き角の大きさを変更するとともに、入力部に入力された目標値に基づいて照射条件を変更する演算部と、演算部で変更された照射条件を孔形成手段３に出力するとともに、演算部で変更された抱き角を抱き角調整機構に出力する出力部とを有する。演算部は、ＣＣＤ１４（検出手段）での検出結果に応じて、照射条件と抱き角とを変更する。【選択図】図１４