SOLID-STATE IMAGE PICK-UP DEVICE AND IMAGING APPARATUS

• Main Authors: OOKA YUTAKA, SASAKI NAOTO
• Format: Patent
• Language: English; Japanese
• Published: 12.04.2018
• Subjects: BASIC ELECTRIC ELEMENTS; DIAGNOSIS; ELECTRIC COMMUNICATION TECHNIQUE; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; HUMAN NECESSITIES; HYGIENE; IDENTIFICATION; MEDICAL OR VETERINARY SCIENCE; PICTORIAL COMMUNICATION, e.g. TELEVISION; SEMICONDUCTOR DEVICES; SURGERY

PROBLEM TO BE SOLVED: To provide a solid-state image pick-up device capable of reducing the height than conventional one.SOLUTION: The solid-state image pick-up device includes: an optical sensor chip; a protection layer which is formed being laminated over the light-receiving surface of the optical sensor chip; and a redistribution layer which is formed being laminated over the surface of the optical sensor chip at the opposite side of the light-receiving surface. The connection terminal of the redistribution layer is a copper flat pad without solder ball, and no alloy layer of tin and copper is formed on the surface the flat pad. The thermal expansion ratio of the protection layer and the thermal expansion ratio of the redistribution layer are generally balanced.SELECTED DRAWING: Figure 33 【課題】従来に比べて固体撮像素子を更に低背化する。【解決手段】光学センサチップと、前記光学センサチップの受光面上に積層形成された保護層と、前記光学センサチップの受光面の反対側の面に積層形成された再配線層と、を有し、前記再配線層の接続端子は、半田ボールレスの銅フラットパッドであり、前記フラットパッドの表面に錫と銅の合金層が形成されておらず、前記保護層の熱膨張率と前記再配線層の熱膨張率とが略均衡していることを特徴とするウェハーレベルチップサイズパッケージの固体撮像素子。【選択図】図３３