MULTILAYER PRINTED WIRING BOARD, MANUFACTURING METHOD OF MULTILAYER PRINTED WIRING BOARD

• Main Authors: NAKAMURA YOSHIHIKO, FUJISAWA HIROYUKI, TOSHIMITSU KENICHI, ARAI DAISUKE, ISAJI KOICHI
• Format: Patent
• Language: English; Japanese
• Published: 12.04.2018
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board capable of suppressing positional deviation of the conductor pattern of a conductor layer of a core board from original position.SOLUTION: A multilayer printed wiring board includes a core board 2, a first build-up layer 31, and a second build-up layer 32. The first build-up layer 31 is formed by laminating a first isolating layer 61 and a first conductor layer 71 alternately. The second build-up layer 32 is formed by laminating a second isolating layer 62 and a second conductor layer 72 alternately. The core board 2, the first isolating layer 61 and the second isolating layer 62 have glass clothes 5, 8, 9. The glass clothes 5, 8, 9 are formed of warp threads 51, 81, 91 and weft threads 52, 82, 92, where the warp threads are narrower than the weft threads 52, 82, 92. Orientation of the warp threads 51, 81, 91 of the glass clothes 8, 9 of the first and second isolating layers 61, 62 adjoining the core board 2 is orthogonal to the orientation of the warp thread 51 of the glass cloth 5 of the core board 2.SELECTED DRAWING: Figure 1 【課題】コア基板の導体層の導体パターンが元の位置から位置ずれすることを抑制することができる多層プリント配線板を提供する。【解決手段】コア基板２と、第１ビルドアップ層３１と、第２ビルドアップ層３２と、を備える。第１ビルドアップ層３１は、第１絶縁層６１と、第１導体層７１と、を交互に積層して形成されている。第２ビルドアップ層３２は、第２絶縁層６２と、第２導体層７２と、を交互に積層して形成されている。コア基板２、第１絶縁層６１及び第２絶縁層６２は、ガラスクロス５、８、９を有する。ガラスクロス５、８、９は縦糸５１、８１、９１及び横糸５２、８２、９２で形成され、縦糸５１、８１、９１の幅が横糸５２、８２、９２の幅よりも狭い。コア基板２に隣接する第１絶縁層６１及び第２絶縁層６２のガラスクロス８、９の縦糸８１、９１の向きと、コア基板２のガラスクロス５の縦糸５１の向きとが直交している。【選択図】図１