LASER MACHINING APPARATUS, AND LASER MACHINING METHOD

PROBLEM TO BE SOLVED: To provide a laser machining apparatus that can achieve satisfactory machining performance by irradiating a machining object immediately in front of the machining tool with a small-diameter laser beam even if the shape and surrounding environment of the machining object cannot...

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Main Authors KUROSAWA KOICHI, HIRANO KATSUHIKO, MATSUURA HIROSHI, ISHIZUKA IPPEI
Format Patent
LanguageEnglish
Japanese
Published 12.04.2018
Subjects
BORING
DECONTAMINATION ARRANGEMENTS THEREFOR
DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINE TOOLS
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
METAL-WORKING NOT OTHERWISE PROVIDED FOR
NUCLEAR ENGINEERING
NUCLEAR PHYSICS
PERFORMING OPERATIONS
PHYSICS
POLISHING
PROTECTION AGAINST X-RADIATION, GAMMA RADIATION, CORPUSCULARRADIATION OR PARTICLE BOMBARDMENT
TRANSPORTING
TREATING RADIOACTIVELY CONTAMINATED MATERIAL
TURNING
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Summary:PROBLEM TO BE SOLVED: To provide a laser machining apparatus that can achieve satisfactory machining performance by irradiating a machining object immediately in front of the machining tool with a small-diameter laser beam even if the shape and surrounding environment of the machining object cannot be accurately known.SOLUTION: A laser machining apparatus is equipped with a laser oscillator or oscillators that oscillate laser beams, a machining tool 8 for machining objects to be machined and an optical fiber or fibers 1 for guiding laser beams from the laser oscillator or oscillators. It is further equipped with an optical fiber feed-out/lead-in mechanism 9 that can set as desired the distance from the laser beam 5 emitting end face of the optical fiber or fibers 1 to immediately before the machining point with the machining tool 8 by arranging at least one optical fiber 1 when a machining object 6 is to be removed from the machining tool 8 in a state of being kept at high temperature by irradiating the object 6 with the laser beam 5 without the presence of any lens in-between.SELECTED DRAWING: Figure 2(A) 【課題】被工作物の形状及び周囲環境が正確に把握できなくても、径が小さい光を工具の直前の被工作物に照射することで加工性能を発揮できるレーザー加工装置を提供する。【解決手段】レーザ光を発振するレーザ発振器と、被加工物を加工するための加工工具８と、レーザ発振器からレーザ光を導光する光ファイバ１とを備えたレーザ加工装置であって、光ファイバ８にレーザ光を導光させ、レンズを介することなく、被工作物６にレーザ光５を照射することにより被工作物６を高温にした状態で加工工具８により除去する際に、加工工具８による加工点の直前部に、光ファイバ１を少なくとも１つ配置し、かつ、光ファイバ１からのレーザ光５の出射端面から加工点の直前部までの距離を任意に設定できる光ファイバ送り出し引き込み機構９を備えている。【選択図】図２（Ａ）
Bibliography:Application Number: JP20160195841