CONDUCTIVE PASTE

PROBLEM TO BE SOLVED: To provide a conductive paste that can form a conductive film having excellent adhesion to a base material.SOLUTION: A conductive paste contains a conductive powder, a resin binder, an organic additive and an organic solvent. The organic additive contains a (meth) acrylate comp...

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Bibliographic Details
Main Authors SHIBAHARA TETSUYA, OKABE KAZUYUKI
Format Patent
LanguageEnglish
Japanese
Published 05.04.2018
Subjects
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Summary:PROBLEM TO BE SOLVED: To provide a conductive paste that can form a conductive film having excellent adhesion to a base material.SOLUTION: A conductive paste contains a conductive powder, a resin binder, an organic additive and an organic solvent. The organic additive contains a (meth) acrylate compound that has two or more (meth) acryloyl groups in one molecule, and has a number average molecular weight of 1000 or less.SELECTED DRAWING: None 【課題】基材との密着性に優れた導電膜を形成することができる導電性ペーストを提供すること。【解決手段】本発明により、導電性粉末と樹脂バインダと有機添加剤と有機溶剤とを含む導電性ペーストが提供される。上記有機添加剤は、1分子中に2個以上の(メタ)アクリロイル基を有し、かつ、数平均分子量が1000以下である(メタ)アクリレート化合物を含む。【選択図】なし
Bibliography:Application Number: JP20160189996