WORK-PIECE PROCESSING DEVICE

• Main Authors: FUKUMITSU HITOSHI, TEZUKA MASAHIRO
• Format: Patent
• Language: English; Japanese
• Published: 05.04.2018
• Subjects: BORING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINE TOOLS; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; POLISHING; TRANSPORTING; TURNING

PROBLEM TO BE SOLVED: To avoid a burnishing tool from being pressed against an inner peripheral surface of a hole of a work-piece at the time of pulling a processing head while applying uniformly arbitrary loads to the inner peripheral surface through the burnishing tool in burnishing processing.SOLUTION: A tool forward/backward movement mechanism 110 of a work-piece processing device 10, when performing burnishing processing, makes a burnishing tool 66 to contact an inner peripheral surface 18 of a hole 14 by protruding a tip part 88 of a cartridge 82 from an initial position inside in a radial direction to outward in the radial direction, while unless performing burnishing processing, separating the burnishing tool 66 from the inner peripheral surface 18 by holding the tip part 88 at the initial position.SELECTED DRAWING: Figure 1 【課題】加工ヘッドの引抜時におけるワークの穴の内周面に対するバニッシュツールの押圧を回避する一方で、バニッシュ加工の際、バニッシュツールから内周面に対して任意の荷重を均一に付与する。【解決手段】ワーク加工装置１０のツール進退機構１１０では、バニッシュ加工を行う場合、カートリッジ８２の先端部８８を半径方向内方の初期位置から半径方向外方に突出させることによりバニッシュツール６６を穴１４の内周面１８に接触させ、一方で、バニッシュ加工を行わない場合には、先端部８８を初期位置に保持することによりバニッシュツール６６を内周面１８から離間させる。【選択図】図１