MULTILAYER VIBRATION DAMPER
PROBLEM TO BE SOLVED: To provide a multilayer vibration damper excellent in vibration damping property.SOLUTION: A multilayer vibration damper is constituted by two or more vibration damping layers (A1) and (A2). (a) a block copolymer (a1) which is a block copolymer composed of a vinyl aromatic poly...
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Main Authors | , , |
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Format | Patent |
Language | English Japanese |
Published |
29.03.2018
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Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To provide a multilayer vibration damper excellent in vibration damping property.SOLUTION: A multilayer vibration damper is constituted by two or more vibration damping layers (A1) and (A2). (a) a block copolymer (a1) which is a block copolymer composed of a vinyl aromatic polymer block (X) and a conjugated diene polymer block (Y) and has a vinyl bond content of 45% or more and/or a hydrogenation product (a2) of the block copolymer, (b) a block copolymer (b1) which is a block copolymer composed of a vinyl aromatic polymer block (X) and a conjugated diene polymer block (Y) and has a vinyl bond content of less than 45% and/or a hydrogenation product (b2) of the block copolymer, (c) and a softening agent for hydrocarbon-based rubber. The vibration damping layer (A1) is a resin composition where a content ratio of the resin (a)+ the (b) having a vinyl content of 30% or more+ the softening agent (C) is 10 wt.% or less, and the vibration damping layer (A2) is a resin composition where a content ratio of the resin (a)+ (b) having the vinyl content of 20% or more+ the softening agent (C) is 10 wt.% or more.SELECTED DRAWING: None
【課題】制振性に優れた多層制振材の提供【解決手段】二層以上の制振層(A1)(A2)で構成される多層制振材。(a)ビニル芳香族重合体ブロック(X)と共役ジエン重合体ブロック(Y)とからなるブロック共重合体でビニル結合含有量が45%以上のブロック共重合体(a1)及び/又は該ブロック共重合体の水素添加物(a2)と、(b)ビニル芳香族重合体ブロック(X)と共役ジエン重合体ブロック(Y)とからなるブロック共重合体でビニル結合含有量が45%未満のブロック共重合体(b1)及び/又は該ブロック共重合体の水素添加物(b2)と、(c)炭化水素系ゴム用軟化剤。制振層(A1)は樹脂(a)+ビニル含有量が30%以上の(b)+軟化剤(c)の含有比率が10重量%以下の樹脂組成物であり、制振層(A2)は樹脂(a)+ビニル含有量が20%以上の(b)+軟化剤(c)の含有比率が10重量%以上の樹脂組成物である多層制振材。【選択図】なし |
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Bibliography: | Application Number: JP20160183738 |