COATING METHOD AND COATING DEVICE

PROBLEM TO BE SOLVED: To prevent reduction in the use efficiency of coating liquid when a coating film is formed in a specific area of a base material.SOLUTION: A coating film is formed in a specific area K1 by relatively moving a base material 7 having the specific area K1 and an unspecific area K2...

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Bibliographic Details
Main Authors TANI YOSHINORI, SUZUKI AKIO, OKAMOTO SHUNICHI, ENZAKI SATOSHI
Format Patent
LanguageEnglish
Japanese
Published 29.03.2018
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Summary:PROBLEM TO BE SOLVED: To prevent reduction in the use efficiency of coating liquid when a coating film is formed in a specific area of a base material.SOLUTION: A coating film is formed in a specific area K1 by relatively moving a base material 7 having the specific area K1 and an unspecific area K2 and an applicator 10 having a slit 12 opened at a tip 17. A liquid pool 2 of coating liquid is formed at the tip 17, at which the slit 12 is opened, by adjusting a pressure of the coating liquid in the applicator 10 having the slit 12, and coating operation is performed for relatively moving the base material 7 and the applicator 10 in a positional relationship that allows the liquid pool 2 to make contact with the specific area K1. In the coating operation, the pressure is adjusted so that the coating liquid of the liquid pool 2 on the specific area K1 remains in the specific area K1 and the coating liquid of the liquid pool 2 on the unspecific area K2 remains at the tip 17.SELECTED DRAWING: Figure 6 【課題】基材の特定領域に塗膜を形成する場合に、塗布液の使用効率が低下するのを防ぐ。【解決手段】特定領域K1及び非特定領域K2を有する基材7と、スリット12が先端17で開口している塗布器10とを相対移動させ、特定領域K1に塗膜を形成する。スリット12を有する塗布器10内の塗布液の圧力を調整することによりこのスリット12が開口する先端17に塗布液の液だまり2を形成し、この液だまり2が特定領域K1に接触可能となる位置関係で基材7と塗布器10とを相対移動させる塗布動作を行う。この塗布動作の際、特定領域K1上の液だまり2の塗布液はこの特定領域K1に残留させ、かつ、非特定領域K2上の液だまり2の塗布液は先端17に留まらせる前記圧力に調整する。【選択図】 図6
Bibliography:Application Number: JP20160182804