CONDUCTIVE PASTE FOR JOINING

PROBLEM TO BE SOLVED: To provide a conductive paste sufficiently stuck to an electronic component during a manufacturing process, and a method for manufacturing an electronic device using the same.SOLUTION: A method for manufacturing an electronic device includes the steps of: preparing a substrate...

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Bibliographic Details
Main Author MATSUURA YUMI
Format Patent
LanguageEnglish
Japanese
Published 22.03.2018
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a conductive paste sufficiently stuck to an electronic component during a manufacturing process, and a method for manufacturing an electronic device using the same.SOLUTION: A method for manufacturing an electronic device includes the steps of: preparing a substrate including a conductive layer; applying a conductive paste onto the conductive layer; mounting an electronic component on the applied conductive paste; and joining the conductive layer and the electronic component by heating the conductive paste. The conductive paste is a conductive paste for joining containing metal powders of 100 pts.wt., a solvent of 5-20 pts.wt., and a polymer of 0.05-3 pts.wt. The polymer includes a first polymer and a second polymer. A molecular weight (Mw) of the first polymer is 5,000 to 95,000, and a molecular weight (Mw) of the second polymer is 100,000 to 300,000.SELECTED DRAWING: Figure 1 【課題】製造プロセス中に、電子部品と十分に接着する導電性ペーストおよびこれを用いた電子デバイスの製造方法を提供する。【解決手段】導電層を含む基板を準備する工程と、導電層の上に導電性ペーストを塗布する工程であって、導電性ペーストが、１００重量部の金属粉、５〜２０重量部の溶媒、および、０．０５〜３重量部のポリマーを含む、接合用の導電性ペーストであり、ポリマーが、第１ポリマーおよび第２ポリマーを含み、第１ポリマーの分子量（Ｍｗ）が５，０００〜９５，０００であり、第２ポリマーの分子量（Ｍｗ）が１００，０００〜３００，０００である、工程と、塗布された導電性ペーストの上に電子部品を搭載する工程と、導電性ペーストを加熱して、導電層と電子部品とを接合する工程とを含む、電子デバイスの製造方法である。【選択図】図１
Bibliography:Application Number: JP20160180702