SEMICONDUCTOR DEVICE

• Main Authors: ICHIMURA TAKESHI, MOROZUMI AKIRA, GOHARA HIROMICHI
• Format: Patent
• Language: English; Japanese
• Published: 15.03.2018
• Subjects: APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC,OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWERSUPPLY SYSTEMS; BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CONTROL OR REGULATION THEREOF; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUTPOWER; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERATION; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a semiconductor device including a cooler that has improved the shape of a connection part of coolant introduction part and exhaust part to reduce pressure loss at the connection part.SOLUTION: A cooler 20 of a semiconductor device comprises: coolant introduction part 27 and exhaust part 28; an introduction path 24; an exhaust path 25; and a channel for coolant 26. An introduction connection part 271 between the introduction path 24 and introduction part 27 faces the channel for coolant 26 immediately below a circuit board 13. An exhaust connection part 281 between the exhaust path 25 and exhaust part 28 faces the channel for coolant 26 immediately below the circuit board 13. The introduction path 24 extends over the width direction of the channel for coolant 26, and has a smaller width than that of the exhaust path 25.SELECTED DRAWING: Figure 8 【課題】冷却液の導入部・排出部の接続部等の形状に改良を加えて、その接続部等における圧力損失を低減させることができた冷却器を備える半導体装置を提供する。【解決手段】半導体装置の冷却器２０は冷却液の導入部２７及び排出部２８と、導入路２４と、排出路２５と、冷却用流路２６と、を有する。導入路２４と導入部２７との間の導入接続部２７１が、回路基板１３直下の冷却用流路２６に対向する。排出路２５と排出部２８との間の排出接続部２８１が、回路基板１３直下の冷却用流路２６に対向する。導入路２４は、冷却用流路２６の幅方向にわたり、排出路２５に比べ幅が狭い。【選択図】図８