METHOD FOR MANUFACTURING PIEZOELECTRIC DEVICE

PROBLEM TO BE SOLVED: To suppress characteristic deterioration of a piezoelectric layer in a manufacturing process.SOLUTION: A method for manufacturing a piezoelectric device includes the steps of: forming a first electrode; forming a piezoelectric layer overlapping with the first electrode; forming...

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Bibliographic Details
Main Authors YAZAKI SHIRO, FUKUZAWA YUMA
Format Patent
LanguageEnglish
Japanese
Published 15.03.2018
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Summary:PROBLEM TO BE SOLVED: To suppress characteristic deterioration of a piezoelectric layer in a manufacturing process.SOLUTION: A method for manufacturing a piezoelectric device includes the steps of: forming a first electrode; forming a piezoelectric layer overlapping with the first electrode; forming a first conductor overlapping with the piezoelectric layer and being electrically conductive to the first electrode; forming a second conductor overlapping with the first conductor; and forming a second electrode overlapping with the piezoelectric layer and being not electrically conductive to the first electrode by patterning the first conductor after execution of the step of forming the second conductor.SELECTED DRAWING: Figure 5 【課題】製造工程における圧電体層の特性劣化を抑制する。【解決手段】第1電極を形成する工程と、前記第1電極に重なる圧電体層を形成する工程と、前記圧電体層に重なり、前記第1電極に導通する第1導電体を形成する工程と、前記第1導電体に重なる第2導電体を形成する工程と、前記第2導電体を形成する工程の実行後に、前記第1導電体をパターニングすることで、前記圧電体層に重なり、前記第1電極に導通しない第2電極を形成する工程とを含む圧電デバイスの製造方法。【選択図】図5
Bibliography:Application Number: JP20160174310