FORMING METHOD OF HEAT INSULATION FILM

PROBLEM TO BE SOLVED: To provide a forming method which can improve the heat resistance of a sealed film which is formed on an apex face of an anode oxide film.SOLUTION: A sealing treatment is performed for enhancing the heat insulation performance of an anode oxide film 10 by at least blocking an o...

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Bibliographic Details
Main Author YAMASHITA HIDEO
Format Patent
LanguageEnglish
Japanese
Published 08.03.2018
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Summary:PROBLEM TO BE SOLVED: To provide a forming method which can improve the heat resistance of a sealed film which is formed on an apex face of an anode oxide film.SOLUTION: A sealing treatment is performed for enhancing the heat insulation performance of an anode oxide film 10 by at least blocking an opening part 12a of an opened blow hole 12. In a first step of the sealing treatment, a solventless sealer (first sealer) is used, and a first silicone oxide film 16 is formed. In a second step of the sealing treatment, a solvent sealer (second sealer) is used, and a second silicone oxide film 18 is formed. An inorganic polymer constituting the second silicone oxide film 18 is higher in melting temperature than an inorganic polymer constituting the first silicone oxide film 16, and sufficiently high in hardness. Actual machine durability can be thereby sufficiently obtained.SELECTED DRAWING: Figure 1 【課題】陽極酸化膜の頂面に形成される封孔膜の耐熱性を向上できる製造方法を提供する。【解決手段】封孔処理は、開気孔12の開口部12aを少なくとも塞いで、陽極酸化膜10の遮熱性を高めるために行われる。封孔処理の第1ステップでは、無溶剤タイプの封孔剤(第1封孔剤)が使用され、第1シリコン系酸化膜16が形成される。封孔処理の第2ステップでは、溶剤タイプの封孔剤(第2封孔剤)が使用され、第2シリコン系酸化膜18が形成される。第2シリコン系酸化膜18を構成する無機系ポリマーは、第1シリコン系酸化膜16を構成する無機系ポリマーに比べて融解温度が高く、また、硬度も十分に高い。従って、実機耐久性が十分な遮熱膜を得ることができる。【選択図】図1
Bibliography:Application Number: JP20160167045