SUBSTRATE PROCESSING APPARATUS

• Main Authors: HAMAMOTO KEISUKE, MINAMIDA JUNYA
• Format: Patent
• Language: English; Japanese
• Published: 01.03.2018
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To keep the height of a device at a reduced level while stacking processing units.SOLUTION: A substrate processing apparatus according to an embodiment comprises a plurality of processing parts, a process fluid supply line and a frame structure. The plurality of processing parts are arranged next to each other in a horizontal direction to process a substrate with use of a process fluid. The process fluid supply line has a horizontal pipeline arranged horizontally under the plurality of processing parts and branch pipes branched from the horizontal pipeline to be connected to the processing parts, respectively. The frame structure has a plurality of pillars and a plurality of beams to house the plurality of processing parts and the process fluid supply line in a housing space formed by the pillars and beams. The beams include first beams and second beams arranged in parallel with an arrangement direction of the plurality of processing parts. The horizontal pipeline is arranged between the first beams and the second beams and between a top face and a bottom face of the first beams, and arranged across the plurality of processing parts.SELECTED DRAWING: Figure 7F 【課題】処理ユニットを積層しつつも装置の高さを抑えること。【解決手段】実施形態に係る基板処理装置は、複数の処理部と、処理流体供給ラインと、フレーム構造体とを備える。複数の処理部は、水平方向に並べて配置され、処理流体を用いて基板を処理する。処理流体供給ラインは、複数の処理部の下方に水平に配置された水平配管、および、水平配管から分岐して処理部のそれぞれへ接続される分岐管とを有する。フレーム構造体は、複数の柱部および複数の梁部を有し、柱部および梁部によって形成される収容空間に複数の処理部および処理流体供給ラインを収容する。また、梁部は、複数の処理部の並び方向と平行に配置された第１梁部および第２梁部を含む。また、水平配管は、第１梁部および第２梁部の間であって、第１梁部の上面と下面の間に配置され、さらに複数の処理部に渡って配置される。【選択図】図７Ｆ