SUBSTRATE AND MANUFACTURING METHOD THEREOF, AND MODULE

• Main Author: TASAKA NAOYUKI
• Format: Patent
• Language: English; Japanese
• Published: 22.02.2018
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To suppress that a metal layer is exposed from a side surface.SOLUTION: A substrate comprises one or more first insulator layers 14 laminated each other, a metal layer 12 that is provided on the one or more first insulator layers and has a side surface positioning inside of at...