SUBSTRATE AND MANUFACTURING METHOD THEREOF, AND MODULE

• Main Author: TASAKA NAOYUKI
• Format: Patent
• Language: English; Japanese
• Published: 22.02.2018
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To suppress that a metal layer is exposed from a side surface.SOLUTION: A substrate comprises one or more first insulator layers 14 laminated each other, a metal layer 12 that is provided on the one or more first insulator layers and has a side surface positioning inside of at least a lower part of the side surface of the one or more first insulator layers, one or more second insulator layers 16 laminated each other that are provided on the metal layer laminated each other and have the side surface positioning inside of at least the lower part of the side surface of the first insulator layers, and a third insulator layer 18 that covers at least a lower part of the side surface of the one or more second insulator layers, the side surface of the metal layer, and a top surface of a peripheral part of the one or more first insulator layers.SELECTED DRAWING: Figure 6 【課題】金属層が側面から露出することを抑制すること。【解決手段】互いに積層された１または複数の第１絶縁層１４と、前記１または複数の第１絶縁層上に設けられ、側面が前記１または複数の第１絶縁層の側面の少なくとも下部より内側に位置する金属層１２と、互いに積層され前記金属層上に設けられ、側面が前記第１絶縁層の側面の少なくとも下部より内側に位置し、互いに積層された１または複数の第２絶縁層１６と、前記１または複数の第２絶縁層の側面の少なくとも下部、前記金属層の側面および前記１または複数の第１絶縁層の周縁部の上面を覆う第３絶縁層１８と、を具備する基板。【選択図】図６