RESIN COMPOSITION AND CURED PRODUCT THEREOF

• Main Authors: FUJII ASUKA, IMOTO TAKESHI, KASHIWAZAKI CHIKASHI, GOTO TOMOTAKA, YAMADA TAKESHI
• Format: Patent
• Language: English; Japanese
• Published: 22.02.2018
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP

PROBLEM TO BE SOLVED: To provide a resin composition that can form a thin film having excellent adhesion, resistant to degradation of solvent resistance, and having a thickness of 1 μm or less.SOLUTION: A resin composition contains (A) an oligomer modified epoxy resin component obtained by the reaction between: a polyphenylene oxide oligomer with a number average molecular weight of 800-10,000, with the content of a constitutional unit represented by general formula (1) (R-R: alkyl groups or the like) being 60 mass% or more of the total content, and having 1.2 or more phenolic hydroxyl groups in average in one molecule; and an epoxy resin, and (B) at least one resin component selected from styrene-butadiene rubber, cyanate ester, and a derivative thereof.SELECTED DRAWING: None 【課題】密着性が良好であるとともに、耐溶剤性が劣化しにくい、厚さ１μｍ以下の薄膜を形成することが可能な樹脂組成物を提供する。【解決手段】（Ａ）数平均分子量が８００〜１０，０００であり、一般式（１）（Ｒ1〜Ｒ4：アルキル基等）で表される構成単位の含有割合が全体の６０質量％以上であり、１分子中に平均１．２個以上のフェノール性水酸基を有するポリフェニレンオキシドオリゴマーと、エポキシ樹脂と、を反応させたオリゴマー変性エポキシ樹脂成分、並びに（Ｂ）スチレンブタジエンゴム、シアネートエステル、及びこれらの誘導体から選ばれる少なくとも１種の樹脂成分を含有する樹脂組成物である。【選択図】なし