CLEANING METHOD FOR SUBSTRATE AND SUBSTRATE PROCESSING APPARATUS

• Main Authors: INUKAI MINAKO, OTSUBO KYO, SAKURAI HIDEAKI
• Format: Patent
• Language: English; Japanese
• Published: 15.02.2018
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a cleaning method for substrate, capable of acquiring a substrate having a highly clean pattern surface.SOLUTION: The cleaning method for substrate includes a first cleaning process and a second cleaning process. The first cleaning process cleans a substrate to be processed. The second cleaning process cleans the substrate to be processed using a cleaning method different from the first cleaning process, following the first cleaning process. The first cleaning process includes at least either one of acid cleaning and alkali cleaning. The second cleaning process includes frozen cleaning.SELECTED DRAWING: Figure 7 【課題】パターン面の清浄度が高い基板を得ることが可能な基板の洗浄方法を提供すること。【解決手段】実施形態の基板の洗浄方法によれば、第１洗浄工程と、第２洗浄工程とを含む。第１洗浄工程は、被処理基板を洗浄する。第２洗浄工程は、前記第１洗浄工程に続いて、前記第１洗浄工程とは異なった洗浄法を用いて、前記被処理基板を洗浄する。前記第１洗浄工程は、酸性洗浄およびアルカリ洗浄の少なくとも１つを含む。前記第２洗浄工程は、凍結洗浄を含む。【選択図】図７