SUBSTRATE FIXING DEVICE AND MANUFACTURING METHOD OF THE SAME

• Main Authors: AOKI SHUZO, ASAHI YOJI, TAKEMOTO KEIICHI, HARAYAMA YOICHI
• Format: Patent
• Language: English; Japanese
• Published: 15.02.2018
• Subjects: BASIC ELECTRIC ELEMENTS; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER; ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR; ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERATION; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a substrate fixing device with improved heat resistance.SOLUTION: A substrate fixing device comprises: an electrostatic chuck which suction-holds a suction object; and a base plate on which the electrostatic chuck is mounted. The substrate fixing device has: the base plate; a heating part provided on the base plate; and the electrostatic chuck provided on the heating part. The heating part comprises: a heating element having at least one roughened surface; and an insulation layer which covers the heating element. The insulation layer is directly bonded to the electrostatic chuck.SELECTED DRAWING: Figure 1 【課題】耐熱性を向上した基板固定装置を提供すること。【解決手段】本基板固定装置は、吸着対象物を吸着保持する静電チャックと、前記静電チャックを搭載するベースプレートと、を備えた基板固定装置であって、ベースプレートと、前記ベースプレート上に設けられた発熱部と、前記発熱部上に設けられた静電チャックと、を有し、前記発熱部は、少なくとも一つの面が粗化された発熱体、及び前記発熱体を被覆する絶縁層を備え、前記絶縁層と前記静電チャックとが直接接合されている。【選択図】図１