LOW DK/DF SOLDER RESIST COMPOSITION FOR PRINTED CIRCUIT BOARD

• Main Authors: HWANG SHAO-EN, LEE CHENGUNG, HSU SHIH-HUNG, HWANG YEONG-TONG
• Format: Patent
• Language: English; Japanese
• Published: 08.02.2018
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; CINEMATOGRAPHY; COMPOSITIONS BASED THEREON; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; HOLOGRAPHY; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MATERIALS THEREFOR; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP

PROBLEM TO BE SOLVED: To provide a solder resist composition showing low dielectric constant (Dk) and low dielectric loss tangent (Df), and having high developability and high resolution, and photosetting and thermosetting properties.SOLUTION: A solder resist composition contains a photopolymerizable prepolymer of the following structure, a photopolymerizable vinyl monomer, an epoxy compound, a photopolymerization initiator, a filler, catalyst, and an organic solvent.SELECTED DRAWING: None 【課題】低誘電率（Ｄｋ）及び低誘電正接（Ｄｆ）を示す、高現像性高解像度と光及び熱硬化性を備えたソルダーレジスト組成物を提供する。【解決手段】下記構造の光重合性プレポリマー、光重合性ビニルモノマー、エポキシ化合物、光重合開始剤、充填剤、触媒、及び有機溶剤を含有するソルダーレジスト組成物。【選択図】なし