SEMICONDUCTOR DEVICE MANUFACTURING METHOD

• Main Authors: SHINOZAKI HIROKI, MORI HIRONARI, MITSUTA MASAYA
• Format: Patent
• Language: English; Japanese
• Published: 01.02.2018
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device which achieves excellent electrical connection reliability when assuming that manufacturing efficiency of the semiconductor device is improved without using a mechanical technique for exposure of a conductor post.SOLUTION: A semiconductor device manufacturing method of the present embodiment includes in the following order: a conductor part formation step of forming on a substrate 10 having a conductor pattern 20, a plurality of conductor parts 40 having the same heights from a surface of the substrate 10; a coating step of introducing a thermosetting resin composition 50 to each clearance between neighboring conductor parts 40 and covering he conductor parts 40 by a hardened material 60 of the thermosetting resin composition 50 in such a manner as to expose tops 92 of the conductor parts 40; and a multilayer wiring step of forming on the hardened material 60, a metal pattern to be electrically connected with the tops 92 without grinding a surface of the hardened material 60.SELECTED DRAWING: Figure 1 【課題】導体ポストの露出に機械的手法を用いないことで、半導体装置の製造効率を向上させることを前提に、電気的接続の信頼性に優れる半導体装置の製造方法を提供する。【解決手段】本発明の半導体装置の製造方法は、導体パターン２０を有する基板１０上に、基板１０の表面からの高さが同じである複数の導体部４０を形成する導体部形成工程と、隣接する導体部４０の間隙に熱硬化性樹脂組成物５０を導入し、導体部４０の頂部９２が露出するように熱硬化性樹脂組成物５０の硬化物６０で導体部４０を覆う被覆工程と、硬化物６０の表面を研磨することなく、硬化物６０の上に頂部９２と電気的に接続する金属パターンを形成する多層配線工程と、をこの順に含む。【選択図】図１