METHOD FOR PLATING NON-CONDUCTIVE BASE MATERIAL SURFACE

• Main Authors: OKADA HIROKI, HAGA MITSURU, RI SHOKA
• Format: Patent
• Language: English; Japanese
• Published: 01.02.2018
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; CINEMATOGRAPHY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; HOLOGRAPHY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MATERIALS THEREFOR; METALLURGY; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; PRINTED CIRCUITS; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

SOLUTION: A method for selectively forming a metal layer of high adhesion at a desired position on a non-conductive base material without performing an etching process on a non-conductive base material surface comprises the steps of: (a) applying a photosensitive composition to form a photosensitive film on the non-conductive base material; (b) exposing at least a part of the photosensitive film to light to cure the exposed part of the photosensitive film; (c) bringing the base material into contact with an alkali liquid developer to remove an unexposed part of the photosensitive film; (d) performing a heat treatment on the base material; (e) bringing the base material into contact with an alkali pretreatment liquid to performing a pretreatment on the exposed part of the photosensitive film with the alkali pretreatment liquid; (f) bringing the base material into contact with a catalyst liquid to provide a catalyst to the exposed part subjected to the pretreatment; and (g) then, performing electroless metal plating on the cured exposed part of the photosensitive film on the base material.EFFECT: It is possible to form a metal plating layer with high adhesion without performing a resin etching of a base material surface.SELECTED DRAWING: None 【解決手段】非導電性基材表面のエッチング処理を行うことなしに、非導電性基材上の所望の箇所に選択的に密着性の高い金属層を形成する方法は、（ａ）非導電性基材上に感光性組成物を適用して感光性フィルムを形成し、（ｂ）感光性フィルムの少なくとも一部を露光して感光性フィルムの露光部を硬化させ、（ｃ）基材をアルカリ性現像液に接触させて感光性フィルムの未露光部を除去し、（ｄ）基材を加熱処理し、（ｅ）基材をアルカリ性前処理液と接触させ、感光性フィルムの露光部をアルカリ性前処理液で前処理し、（ｆ）基材を触媒液と接触させ、前記前処理済みの露光部に触媒を提供し、その後（ｇ）基材上の硬化した感光性フィルムの露光部上に無電解金属めっきを行う工程を含む。【効果】基材表面の樹脂エッチングを行わずに、密着性の高い金属めっき層を形成できる。【選択図】なし