METAL-CERAMIC CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

• Main Author: SHIMAZU MASAHIRO
• Format: Patent
• Language: English; Japanese
• Published: 01.02.2018
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a metal-ceramic circuit board capable of preventing solder crack generation or breakdown of a chip, even if a heat cycle is applied repeatedly under more severe conditions than ever.SOLUTION: One side of a metal circuit board 12 is bonded directly to one side of a ceramic substrate 10, a metal base plate 14 is bonded directly to the other side, a nickel plating membrane 18 having a thickness of 17 μm or more (preferably 17-100 μm, more preferably 20-60 μm) is formed on the other side of the metal circuit board 12, and a chip component 24 is soldered onto the nickel plating membrane 18 via a solder layer 22.SELECTED DRAWING: Figure 1 【課題】従来よりも厳しい条件のヒートサイクルが繰り返し加えられても半田クラックの発生やチップの破損を防止することができる、金属−セラミックス回路基板およびその製造方法を提供する。【解決手段】セラミックス基板１０の一方の面に金属回路板１２の一方の面が直接接合するとともに、他方の面に金属ベース板１４が直接接合し、金属回路板１２の他方の面に厚さ１７μｍ以上（好ましくは１７〜１００μｍ、さらに好ましくは２０〜６０μｍ）のニッケルめっき皮膜１８が形成され、このニッケルめっき皮膜１８上に、半田層２２介してチップ部品２４が半田付けされている。【選択図】図１