MASK AND MANUFACTURING METHOD OF WIRING BOARD

PROBLEM TO BE SOLVED: To provide a mask in which a through-hole or the like of a green sheet, for example, can be sufficiently filled with a filler, and a manufacturing method of a wiring board.SOLUTION: A front face 11 of a metal mask 1 includes a groove 15 from the front face 11 to a through-hole...

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Bibliographic Details
Main Authors HASEGAWA MASAMI, KONDO SHINSUKE
Format Patent
LanguageEnglish
Japanese
Published 01.02.2018
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Summary:PROBLEM TO BE SOLVED: To provide a mask in which a through-hole or the like of a green sheet, for example, can be sufficiently filled with a filler, and a manufacturing method of a wiring board.SOLUTION: A front face 11 of a metal mask 1 includes a groove 15 from the front face 11 to a through-hole 3, and a portion 17 of the groove 15 opened in the through-hole 3 faces a portion of an inner peripheral surface 19 of the through-hole 3. In a planar view, the groove 15 of the metal mask 1 is formed to extend in one direction relatively to the through-hole 3, and a width in the portion 17 of the groove 15 opened in the through-hole 3 is equal to or smaller than a hole diameter of the through-hole 3. Further, a bottom face 21 of the groove 15 includes: an inclined face 23 on which a distance between the front face 11 and the bottom face 21 is increased towards the through-hole 3; and a flat face 25 from the inclined face 23 to the through-hole 3. Therefore, the metal mask 1 is used to sufficiently fill a through-hole 7 of a green sheet 5 with a metalization ink 31.SELECTED DRAWING: Figure 3 【課題】例えばグリーンシートの貫通孔などに対して、十分に充填材を充填することができるマスク及び配線基板の製造方法を提供することにある。【解決手段】メタルマスク1の表面11に、表面11から貫通穴3に到る溝15を有するとともに、溝15の貫通穴3に開口する部分17は、貫通穴3の内周面19の一部と対向している。また、平面視で、メタルマスク1の溝15は、貫通穴3に対して一方向に延びるように形成されており、溝15の貫通穴3に開口する部分17における幅は貫通穴3の穴径以下である。更に、溝15の底面21は、貫通穴3に向かうにつれて表面11と底面21との距離が増加する傾斜面23と、傾斜面23から貫通穴3に至る平坦面25を有している。従って、このメタルマスク1を用いて、グリーンシート5の貫通孔7にメタライズインク31を十分に充填することができる。【選択図】図3
Bibliography:Application Number: JP20160146388