BUFFER PACKAGING MATERIAL, BUFFER PACKAGING MATERIAL ASSEMBLY, AND PACKAGING METHOD USING BUFFER PACKAGING MATERIAL

PROBLEM TO BE SOLVED: To provide a buffer packaging material capable of efficiently and effectively improving buffer performance without drastically increasing a packing volume and a packing cost.SOLUTION: Buffer packaging materials 10A and 10B of the present invention include body buffer parts 10AA...

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Bibliographic Details
Main Author SHIBAZAKI TSUYOSHI
Format Patent
LanguageEnglish
Japanese
Published 01.02.2018
Subjects
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Summary:PROBLEM TO BE SOLVED: To provide a buffer packaging material capable of efficiently and effectively improving buffer performance without drastically increasing a packing volume and a packing cost.SOLUTION: Buffer packaging materials 10A and 10B of the present invention include body buffer parts 10AA and 10BA that form a storage space capable of surrounding an article 80 to be packaged after air is infilled into a partitioned and sealed bag 20, and bottom-up buffer parts 10AB and 10BB that are opened in a Y-shape to the outside so as to raise bottom levels of the body buffer parts 10AA and 10BA after the air is infilled into the partitioned and sealed bag 20.SELECTED DRAWING: Figure 1 【課題】梱包体積及び梱包コストを大きく増大させることなく、効率的且つ効果的に緩衝性能を高めることができる緩衝包装材を提供する。【解決手段】本発明の緩衝包装材10A,10Bは、区画密封袋部20内への空気充填後に被包装物80を取り囲むことができる収容空間を形成する本体緩衝部10AA,10BAと、区画密封袋部20内への空気充填後に本体緩衝部10AA,10BAを底上げするように外側にY字状に開く底上げ緩衝部10AB,10BBとを有する。【選択図】 図1
Bibliography:Application Number: JP20160149621