ELEMENT SUBSTRATE, RECORDING HEAD AND RECORDING APPARATUS

• Main Authors: KASAI SHINTARO, SAKURAI MASATAKA
• Format: Patent
• Language: English; Japanese
• Published: 01.02.2018
• Subjects: CORRECTION OF TYPOGRAPHICAL ERRORS; i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; LINING MACHINES; PERFORMING OPERATIONS; PRINTING; SELECTIVE PRINTING MECHANISMS; STAMPS; TRANSPORTING; TYPEWRITERS

PROBLEM TO BE SOLVED: To suppress a rise in cost accompanying an increase in size of an element substrate and multilayering of wiring and further suppress heater deterioration caused by excessive energy introduction while increasing the number of heaters which are driven simultaneously on the element substrate for improvement in recording speed.SOLUTION: There is provided power supply wiring which supplies a source voltage from a power supply pad to a plurality of heaters arranged on an element substrate, respectively. Here, resistance values of the plurality of heaters are so set that a heater arranged at a longer distance from the power supply pad has a lower resistance value, and a heater arranged at a shorter distance from the power supply pad has a higher resistance value.SELECTED DRAWING: Figure 4 【課題】記録速度の向上のために素子基板で同時駆動するヒータの数を増やしながら、素子基板のサイズの増大や配線の多層化などに伴うコスト上昇を抑制し、更に余剰なエネルギーの投入によるヒータ劣化を抑えることである。【解決手段】素子基板に配置される複数のヒータそれぞれに対して電源パッドから電源電圧を共通に供給する電源配線を設ける。ここで、複数のヒータそれぞれの抵抗値は、前記電源パッドから距離が遠い位置に配置されるヒータの抵抗値が低く、前記電源パッドからの距離が近い位置に配置されるヒータの抵抗値が高くされる。【選択図】 図４