MULTI-LAYER TRANSMISSION LINE PLATE

• Main Authors: MIZUSHIMA ETSUO, KONDO YUSUKE, TANIGAWA TAKAO
• Format: Patent
• Language: English; Japanese
• Published: 25.01.2018
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

PROBLEM TO BE SOLVED: To provide a multi-layer transmission line plate capable of reducing skew in differential transmission without using a complicated manufacturing process.SOLUTION: A multi-layer transmission line plate 11 includes: a pair of ground layers 12, 13; a differential wiring 16 arranged between the pair of ground layers 12, 13; a first insulation layer 14 for insulating the one ground layer 12 from the differential wiring 16; and a second insulation layer 15 for insulating the other ground layer 13 from the differential wiring 16. The second insulation layer 15 includes a first layer 15a including resin but not including glass cloth, a second layer 15b including resin and glass cloth, and a third layer 15c including resin but not including glass cloth, in this order.SELECTED DRAWING: Figure 2 【課題】複雑な製造プロセスを用いることなく、差動伝送におけるスキューを低減することが可能な多層伝送線路板を提供すること。【解決手段】一対のグランド層１２，１３と、一対のグランド層１２，１３の間に配置された差動配線１６と、一方のグランド層１２と差動配線１６とを絶縁する第一の絶縁層１４と、他方のグランド層１３と差動配線１６とを絶縁する第二の絶縁層１５と、を備え、第二の絶縁層１５が、樹脂を含有しガラスクロスを含有しない第一の層１５ａと、樹脂及びガラスクロスを含有する第二の層１５ｂと、樹脂を含有しガラスクロスを含有しない第三の層１５ｃと、をこの順に有する、多層伝送線路板１１。【選択図】図２