POLYAMIDE RESIN COMPOSITION FOR LASER WELDING

• Main Authors: NAKAGAWA YASUSHI, AKITA DAI, UMEZU HIDEYUKI, MASUNAGA ATSUSHI, NISHIDA SHINGO
• Format: Patent
• Language: English; Japanese
• Published: 25.01.2018
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

PROBLEM TO BE SOLVED: To provide a polyamide resin composition for laser welding which is capable of giving a composite molding excellent in weldability, mechanical strength, and dimensional stability.SOLUTION: The polyamide resin composition for laser welding according to the present invention contains: 0.1-20 pts.mass of a compound (B) having three or more hydroxyl groups in one molecule based on 100 pts.mass of a polyamide resin (A); and a phosphorus-containing compound (C). A phosphorus atom content determined by absorptiometry is 400-3,500 ppm based on the content of the polyamide resin.SELECTED DRAWING: None 【課題】本発明は、溶着性、機械強度および寸法安定性に優れた複合成形品を得ることのできるレーザー溶着用ポリアミド樹脂組成物を提供する。【解決手段】本発明のレーザー溶着用ポリアミド樹脂組成物は、ポリアミド樹脂（Ａ）１００質量部に対して、１分子中に３つ以上の水酸基を含む化合物（Ｂ）を０．１〜２０質量部および（Ｃ）リン含有化合物を含有し、吸光光度分析法により求められるリン原子含有量がポリアミド樹脂含有量に対して４００〜３５００ｐｐｍであることを特徴とするレーザー溶着用ポリアミド樹脂組成物である。【選択図】 なし