THERMALLY CONDUCTIVE FLEXIBLE PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THERMALLY CONDUCTIVE FLEXIBLE PRINTED WIRING BOARD

• Main Authors: UCHIDA YOSHIFUMI, MURATA KAZUO
• Format: Patent
• Language: English; Japanese
• Published: 18.01.2018
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

PROBLEM TO BE SOLVED: To provide a thermally conductive flexible printed wiring board capable of effectively facilitating the heat radiation of a heat source, and its manufacturing method.SOLUTION: A thermally conductive flexible printed wiring board according to one aspect of the present invention uses a double-side copper pasted plate including an insulation layer and a pair of copper foils laminated on both sides of the insulation layer. The thermally conductive flexible printed wiring board includes: a heat source implemented on a front face side; a heat sink portion arranged at a position away from the heat source and on the front face; and a copper foil continuous region continuing between the heat source and the heat sink portion.SELECTED DRAWING: Figure 1 【課題】本発明は、熱源の放熱を効果的に促進できる熱伝導性フレキシブルプリント配線板及びその製造方法の提供を目的とする。【解決手段】本発明の一態様に係る熱伝導性フレキシブルプリント配線板は、絶縁層とこの絶縁層の両面に積層される一対の銅箔とを有する両面銅貼り板を用いる熱伝導性フレキシブルプリント配線板であって、表面側に実装される熱源と、上記熱源から離間した位置かつ表面に配設されるヒートシンク部と、上記熱源及びヒートシンク部間に連続する上記銅箔連続領域とを備える。【選択図】図１